Dual-Row Devices Provide Optimal Connection Integrity in An Array of High-Density Board-to-Board Applications.

San Marcos, CA, August 31, 2011...Announced today by Sullins Connector Solutions, a global leader in designing and manufacturing RoHS-compliant board-level interconnects, is the addition of the dual-row 1.00 mm (0.039") centerline SBH51 Series Fully Shrouded Male Box Headers and corresponding SFM210 Series Fully Shrouded Female Header Mates. Parts are the newest members of the expanding SBH and SFM Series of fully shrouded devices, and are engineered to minimize the risk of mismating in high-density board-to-board applications where superior signal performance is required. Provided in plated through hole (PTH), and with/without guideposts in surface mount (SMT) terminations, parts facilitate design flexibility and manufacturing efficiencies while helping customers reduce vendor count. The UL94V-0 connectors feature an extended temperature range of -40 degrees C to +125 degrees C, and are compatible with reflow processes up to 260 degrees C peak.
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Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a 9Gb (gigabit) DDR3 SDRAM memory device that is the first of its kind to be packaged in a single plastic ball grid array (PBGA) and offered as a compact x72 dual in-line memory module (DIMM). The solution enables designers to pack up to 4GByte memory densities into smaller, faster systems used in mission-critical applications. These include secure communications, missile systems, munitions and other applications that operate in demanding environments and require extended-temperature ranges.
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W3J128M72G-XPBX download

Chip Quik is a specially formulated alloy in wire form designed to melt at the low tem- perature of 136 degrees F, 58 degrees C. It eliminates the potential for damage to the circuit, adjacent components, and the device itself. This method requires no expensive removal equipment or potentially damaging heating guns. The removal process is suprisingly easy. Liquid flux and a soldering iron are used to melt the Chip Quik low temperature alloy that is specially formulated to stay molten long enough to react with existing solder. The SMT device can then be easily removed with a vacuum pen.

Features

• Quickly remove surface mounted devices (SMDs) without expensive rework equipment
• Removes QFPs, PLCCs, SOICs and others SMD chip components under 300 degrees F
• Prevents damage to the PC board, adjacent components, and the device itself
• Complete removal in four easy steps
• Easy clean-up
• Easy instructions provided
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Twinstar now launch new product line Microsemi/PMG Contactors ,Ralays,pressure tranducer serises . Microsemi Power Management Group manufactures high reliability aerospace, military, and commercial relays, remote power controllers, contactors,pressure tranducer timers, sensors from 1 to 200 amp ratings, and custom devices. QPL ratings are maintained for MIL-R-39016 , 6106, & 83536 Specifications. Products are also produced to MIL-R-5757 & 83383 Specifications. MIL-Spec processes are maintained for plating, and environmental testing. Product styles include crystal can, miniature, magnetic latching, reed, hermetically sealed, and welded construction. (Contact us for details)