The Microsemi TRRUST-Stor™ solid state drive is now available with an optional ruggedized SATA connector that solves shock and vibration issues prevalent in defense and industrial applications. Specially designed for hostile environments, these connectors withstand conditions for which industry-standard SATA connectors are inadequate. A unique contact and pin design eliminates pin fretting and intermittent disconnects to assure long-term dependability. Available in several form factors, from board-mount to cable sets, the connector family provides a complete vibration-resistant solution for applications where solid performance and zero downtime are key requirements. These ruggedized connectors make TRRUST-Stor the ultimate solid state solution for mission critical applications.

Key Connector Features:

• 50% lower contact resistance than conventional designs
• Vibration and shock immune
• Minimum of 100,000 insertions with little to no performance degradation
• Locking mechanism
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FEATURES

• Mountable 0.50mm, 0.80mm, 1.00mm, 1.27mm pitch BGA/QFN up to 900 pins.
• Sockets available to mount adapter boards if needed.
• The BGA signals are all routed to test point holes on the outer edges for each connection to your mother board or test instrument.
• Each board will fit any chip package within the specified grid size and ball pitch.
• Customs available upon request

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Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a 9Gb (gigabit) DDR3 SDRAM memory device that is the first of its kind to be packaged in a single plastic ball grid array (PBGA) and offered as a compact x72 dual in-line memory module (DIMM). The solution enables designers to pack up to 4GByte memory densities into smaller, faster systems used in mission-critical applications. These include secure communications, missile systems, munitions and other applications that operate in demanding environments and require extended-temperature ranges.
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W3J128M72G-XPBX download

Chip Quik is a specially formulated alloy in wire form designed to melt at the low tem- perature of 136 degrees F, 58 degrees C. It eliminates the potential for damage to the circuit, adjacent components, and the device itself. This method requires no expensive removal equipment or potentially damaging heating guns. The removal process is suprisingly easy. Liquid flux and a soldering iron are used to melt the Chip Quik low temperature alloy that is specially formulated to stay molten long enough to react with existing solder. The SMT device can then be easily removed with a vacuum pen.

Features

• Quickly remove surface mounted devices (SMDs) without expensive rework equipment
• Removes QFPs, PLCCs, SOICs and others SMD chip components under 300 degrees F
• Prevents damage to the PC board, adjacent components, and the device itself
• Complete removal in four easy steps
• Easy clean-up
• Easy instructions provided
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Twinstar now launch new product line Microsemi/PMG Contactors ,Ralays,pressure tranducer serises . Microsemi Power Management Group manufactures high reliability aerospace, military, and commercial relays, remote power controllers, contactors,pressure tranducer timers, sensors from 1 to 200 amp ratings, and custom devices. QPL ratings are maintained for MIL-R-39016 , 6106, & 83536 Specifications. Products are also produced to MIL-R-5757 & 83383 Specifications. MIL-Spec processes are maintained for plating, and environmental testing. Product styles include crystal can, miniature, magnetic latching, reed, hermetically sealed, and welded construction. (Contact us for details)