Application Notes

• PLL Based Design Advantages   The Advantages of PLL Based Design.
  
  
• W72M64V-XBX Flash   Discussion of basic operation of WEDC W72M64V-XBX Flash.
  
  
• Thermal Design Considerations   Basic discussion of WEDC thermal information for non-BGA products.
  
  
• PBGA Thermal Resistance Correlation   Discussion of the correllation of WEDC\'s thermal resistance models to actual thermal resistance measurements.
  
  
• Designing High Performance Systems Using WEDCs Registered SDRA   Discussion of design advantages of registered SDRAM MCPs.
  
  
• Manufacturing Flow for PBGA Products  
  
  
• Decoupling in High Speed Environments   Recommendations regarding decoupling in high speed environments.
  
  
• 2nd Level Interconnect Reliability Of Ceramic Area Array Package   Discussion of 2nd level reliability of CBGA package.
  
  
• SSRAM Overview   Discussion of various SSRAM types; advantages, disadvantages and typical application.
  
  
• Designing for Cost Effective Flip Chip Technology   Recommendations for wafer processing, redistribution, bump metallurgies, bump placement and flip chip assembly.
  
  
• Alpha Particle Considerations in Flip Chip Technology   Pertinent issues associated with soft errors, lead free solders, and reduction of alpha content in flip chip bumping.
  
  
• G2T - G2L CQFP Package Comparison   Package comparison of G2T and G2L CQFP package types.
  
  
• G2U to G1U Package Comparison   Package comparision based on CQFP package change from G2U to G1U Package Comparison.
  
  
• G2T to G2U Package comparision   Package comparision based on CQFP package G2T to G2U type.
  
  
• Flash Memory Operation 1M5   Discussion of basic operation of all WEDC Flash products using 1Mb 5V Flash die.
  
  
• Flash Memory Operation 4M5   Discussion of basic operation of all WEDC Flash products using 4Mb 5V Flash die.
  
  
• Flash Memory Operation 8M3   Discussion of basic operation of all WEDC Flash products using 8Mb 3.3V Flash die.
  
  
• Flash Memory Operation 16M5   Discussion of basic operation of all WEDC Flash products using 16Mb 5V Flash die.