WEDC Commercial Microelectronics success is based on achievements developing products for aerospace/defense, industrial and commercial markets. We provide high-density memory products and multi-chip modules to data communications and telecommunications providers. We are skilled at difficult BGA assembly, rework and inspection of multiple assembly technology of COB, Flip Chip, CSP, BGA and all other surface mount or through-hole devices on the same card.

Our assembly floor and advanced equipment is specifically targeted to support high-mix boards in low to medium volumes. We provide a broad range of services such as :

• Design of semiconductor packages
• Circuit board design and layout
• Component selection
• Test development
• Turnkey circuit card assembly

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