>> Mixed Memory

Our family of mixed memory based Multi-Chip Packages (MCPs) are designed to provide an optimized high density memory solution that mixes different types of memory technology such as SRAM and Flash, SRAM and EEPROM which also meets the data widths necessary for their applications.
In x16 and x32 data width configurations, these mixed memories provide many benefits such as; optimum mixed density configuration, hermetic and non-hermetic packaging, surface mount and through-hole attachment types, space savings, and extended temperature range testing including industrial and military.